New Delhi, Dec 12 – In a briefing to Parliament, officials announced that the Semicon India Programme has cleared 10 new units, bringing total investment to ₹1.6 lakh crore. These centres will cover silicon fabs, silicon‑carbide fabrication, advanced packaging and memory packaging. Union Minister of State for Electronics and IT Jitin Prasada told the Rajya Sabha that the new plants will satisfy chip demand for a range of sectors, from consumer appliances and industrial electronics to cars, telecom, aerospace and power electronics.
“Few of the approved proposals are using indigenous technology for assembly, testing, and packaging of semiconductor chips,” Prasada said.
The government’s production‑linked incentive (PLI) scheme, aimed at large‑scale mobile‑phone manufacturing and key components, has already attracted ₹14 065 crore in investment up to October 2025. In a similar vein, a PLI dedicated to IT hardware—targeting laptops, tablets, servers and ultra‑small‑form‑factor devices—has drawn ₹846 crore by the same deadline.
These policy moves have pushed the electronics manufacturing sector roughly sixfold over the past decade, rising from ₹1.9 lakh crore in 2014‑15 to ₹11.32 lakh crore in 2024‑25. Exports followed suit, growing eight times from ₹38 000 crore to ₹3.26 lakh crore, positioning electronics as the country’s third‑largest export category, according to the minister.
To tap India’s chip‑design talent, the Design Linked Incentive (DLI) scheme now supports 23 companies (24 designs) working on chips and system‑on‑chips for applications ranging from satellite communications and drones to surveillance cameras, IoT devices, LED drivers, AI gadgets, telecom gear and smart meters.
na/vd
Stay informed on all the latest news, real-time breaking news updates, and follow all the important headlines in world News on Latest NewsX. Follow us on social media Facebook, Twitter(X), Gettr and subscribe our Youtube Channel.
